Circuit carrier, particularly printed circuit board for electric circuits, has substrate with upper side and lower side, and heat-generating component which is arranged over recess area on upper side of substrate

摘要

The circuit carrier (10) has a substrate (12) with an upper side (18) and a lower side (24), and a heat-generating component which is arranged over a recess area (16) on the upper side of the substrate. A metal thin layer is laminated on the lower side of the substrate and is arranged around the recess area. The circuit carrier has a cooling element (36) which is embedded partially in a cooling layer (34). The cooling layer consists of metal, particularly copper, or a ceramic material. An independent claim is included for a method for applying a cooling layer on a circuit carrier, particularly on a printed circuit board for electric circuits.