METHOD FOR THE PRODUCTION OF LAMINATED CERAMIC ELECTRONIC PARTS

摘要

A method of producing a multi-layer ceramic substrate by firing in a state where bonding layers which are not sintered during firing are arranged on the principal surfaces of an unsintered ceramic laminate and then the bonding layers are removed, wherein removal of the bonding layers becomes more difficult if the bonding strength of the bonding layers is high, whereas the bonding layers can be removed easily if the bonding strength is low. A conductor pattern (5 - 9) which contains Ag as the main component is formed and first base material layers (1) and second base material layers (2) are laminated in the unsintered ceramic laminate (12). The second base material layers (2) are arranged along at least one principal surface of the unsintered ceramic laminate (12) and the bonding layers (10, 11) are arranged so as to be in contact with the second base material layers (2). A composition in which during firing Ag diffuses more easily into the second base material layers (2) than into the first base material layers (1) is employed and the bonding strength is improved by reducing the glass softening point without the need to use a means of reducing the particle size of the ceramic powder contained in the bonding layers, which is not readily sintered.