WIRING STRUCTURE, INDUCTOR, SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device for which the need for increasing the line width of wiring is eliminated, and the size is reduced by eliminating vias.

SOLUTION: At a part where a part MT1e of first wiring and a part MT2d of second wiring need to cross, an insulating layer DEb is formed between the part MT1e of the first wiring and the part MT2d of the second wiring; the part of the first wiring is provided in contact with one surface of the insulating layer; and the part of the second wiring is provided in contact with the other surface of the insulating layer.

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