| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cleaning a cutter blade for cutting an adhesive tape affixed onto the surface of a semiconductor wafer, along a wafer contour thereof, which efficiently cleans the cutter blade and making the cutter blade serviceable for an extended period of time. SOLUTION: After a cutter blade 12 is returned to its standby position after cutting the adhesive tape, a cleaning unit 56 is moved below the cutter blade 12, and the blade 12 is lowered to a predetermined height. At this time, the cutter blade 12 is stuck into a cleaning member 66 impregnated with a cleaning liquid to remove adhering substances from the cutter blade 12, and the sticking position of the cutter blade 12 into the cleaning member 66 is changed for every sticking cleaning process. COPYRIGHT: (C)2009,JPO&INPIT
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