| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a vacuum chamber as a whole without enlarging the diameter of the vacuum chamber even if the number of required targets is increased. SOLUTION: The multitarget sputtering apparatus successively conveys a plurality of targets 7 to the sputtering positions within the vacuum chamber 1, and successively sputters the targets 7 in the sputtering positions to deposit thin films on substrates 12 opposed to the targets 7. Target holders 3 in which the plurality of target 7 are arranged in a circle are disposed on one above the other in multiple steps, within the vacuum chamber 1. A rotating mechanism 5 which intermittently rotates the target holders 3 around the center of the circle, and a lifting mechanism 4 which vertically moves the one target 7 from the target holders 3, conveys the target 7 to the sputtering position, and further returns the target 7 from the sputtering position to the target holders 3 are provided. COPYRIGHT: (C)2009,JPO&INPIT
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