| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for joining electronic parts, which is excellent in storage stability, can be cured in a short period of time at comparatively low temperature and can prevent occurrence of warpage in joined semiconductor chips. SOLUTION: The adhesive for joining electronic parts comprises a curable compound, a curing agent and a curing accelerator. The curing accelerator is an imidazole compound clathrated to a tetrakisphenol compound or an imidazole compound clathrated to a dicarboxylic acid compound. The curing agent is a thiol compound. COPYRIGHT: (C)2009,JPO&INPIT
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