发明名称 ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 Provided is an elastic wave device which can prevent flux from flowing into a hollow space when the elastic wave device is mounted using solder bumps. An elastic wave device comprises (a) a substrate (11), (b) a vibration portion (14) formed on one major surface (11a) of the substrate (11), (c) a pad (13) formed on one major surface (11a) of the substrate (11) and electrically connected with an electrode (12) of the vibration portion (14), (d) a supporting layer (20) provided on one major surface (11a) of the substrate (11) so as to surround the periphery of the vibration portion (14), (e) a sheet cover layer (22) composed of a resin containing a synthetic rubber and provided on the supporting layer (20) so as to form a hollow space (19) around the vibration portion (14), (f) a protective layer (24) composed of a flux-resistant resin and provided on the side of the cover layer (22) opposite to the supporting layer (20), (g) a via conductor (16) penetrating the protective layer (24), the cover layer (22) and the supporting layer (20) and connected with the pad (13), and (h) an external electrode (18) provided at an end of the via conductor (16) on the side of the protective layer (24) and consisting of a solder bump.
申请公布号 WO2009104438(A1) 申请公布日期 2009.08.27
申请号 WO2009JP50666 申请日期 2009.01.19
申请人 MURATA MANUFACTURING CO., LTD.;TAKADA, NORIHIKO;KADOI, ATSUSHI;KUDO, HAYAMI 发明人 TAKADA, NORIHIKO;KADOI, ATSUSHI;KUDO, HAYAMI
分类号 H03H9/25;H03H3/02;H03H3/08;H03H9/02;H03H9/17;H03H9/72 主分类号 H03H9/25
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