Sensor device for three-dimensional measurement of e.g. flip chip, in manufacturing system, has camera unit to record object under observation direction, which together with illumination direction includes angle differ from zero

摘要

The sensor device (130) has sensor modules (140) attached at a base element i.e. base plate. The sensor modules exhibit an illumination unit and a camera unit. The illumination unit is arranged for illuminating an object i.e. electronic component, to be measured under an illumination direction. The camera unit is arranged for recording the object to be measured under an observation direction, which together with the illumination direction includes a triangulation angle that differs from zero. Independent claims are also included for the following: (1) a method for three-dimensional measurement of electronic component, attached on an electronic switching substrate according to triangulation principle (2) a system for manufacturing an electronic component.