发明名称 ETCHING CONTROL DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an etching control device which enables real time automatic control of a composition of an etchant, as the etching control device for controlling an etching device for etching a printed circuit board etc., subjected to pattern resist. <P>SOLUTION: The etchant of low reaction rate where sulfuric acid and hydrogen peroxide solution are mixed, is used in the etching device so as to etch the printed circuit board etc., of a fine pitch over a long time. Also, one sensor of an infrared ray system is used for detecting the concentration of the sulfuric acid and the hydrogen peroxide solution to detect more accurate concentration while reducing the cost required for equipment. As a result, the composition of the etchant can be controlled in real time even in etching of the thinner and more precise printed circuit board etc. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009191312(A) 申请公布日期 2009.08.27
申请号 JP20080032748 申请日期 2008.02.14
申请人 NIPPON AQUA KK 发明人 AKASEGAWA KATSUO
分类号 C23F1/18;G01N21/35;G01N21/3577;H05K3/06 主分类号 C23F1/18
代理机构 代理人
主权项
地址