| 摘要 |
A semiconductor sensor chip includes a thin diaphragm and an electrical circuit formed on a front surface of the diaphragm. The diaphragm distorts according to a pressure difference between pressures applied on both surfaces of the diaphragm, and the diaphragm distortion is converted into an electrical signal. Both surfaces of the diaphragm are covered with protecting members to protect the sensor chip from dusts and moisture contained in the gas. Since the gas is introduced to the rear surface of the diaphragm through a small passage while the front surface receives pressure with a relatively large area, the protecting member covering the rear surface is made softer than that covering the front surface. Thus, the sensor chip is properly protected against dusts and moisture. |
