| 摘要 |
An optical communication device contains a semiconductor chip that performs wireless communication and a wireless-signal-and-optical-signal conversion chip substrate that mounts the semiconductor chip. The semiconductor chip (10) includes a first wireless communication circuit element and a first antenna element (12,13). The first wireless communication circuit element is connected to the first antenna element. The wireless-signal-and-optical-signal conversion chip substrate (20) includes a second wireless communication circuit element, a second antenna element (27,22) and an optical communication element. The second wireless communication circuit element is connected to the second antenna element. The optical communication element is connected to the second wireless communication circuit element. The wireless-signal-and-optical-signal conversion chip substrate mounts the semiconductor chip with the first antenna element of the semiconductor chip and the second antenna element of the wireless-signal-and-optical-signal conversion chip substrate being faced with each other. |
