发明名称 |
COMPOSITIONS AND METHODS FOR CMP OF LOW-K DIELECTRIC MATERIALS |
摘要 |
<p>The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.</p> |
申请公布号 |
EP2092035(A2) |
申请公布日期 |
2009.08.26 |
申请号 |
EP20070861800 |
申请日期 |
2007.11.07 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
KELEHER, JASON;WOODLAND, DANIEL;DE REGE THESAURO, FRANCIS;MEDSKER, ROBERT;AGGIO, JASON |
分类号 |
C09K3/14;H01L21/321 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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