发明名称 |
Polishing copper-containing patterned wafers |
摘要 |
An aspect of the invention provides a method for polishing a patterned semiconductor wafer containing a copper interconnect metal with a polishing pad. The method includes the following: a) providing an aqueous polishing solution, the polishing solution containing an benzotriazole (BTA) inhibitor and a copper complexing compound and water; b) polishing the patterned wafer with the aqueous polishing solution and the polishing pad in a manner that dissolves copper into Cu |1 ions, the Cu |1 ions and BTA inhibitor having a concentration where [BTA] * [Cu 1 ] > than Ksp for Cu-BTA precipitate if the aqueous solution did not contain the complexing compound; and c) oxidizing at least some of the copper ions to prevent the polishing from precipitating the Cu-BTA precipitate.
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申请公布号 |
EP2093789(A2) |
申请公布日期 |
2009.08.26 |
申请号 |
EP20090152376 |
申请日期 |
2009.02.09 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
THOMAS, TERENCE M.;WANG, HONGYU |
分类号 |
H01L21/321;C09G1/02;C09G1/04 |
主分类号 |
H01L21/321 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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