MINIATURE MICROPHONE ASSEMBLY WITH SOLDER SEALING RING

摘要

A miniature microphone assembly including a solder sealing ring is provided to improve electrical insulation by encapsulating electrical terminals of a microphone carrier and an integrated circuit die inside a cavity. A capacitive microphone converter includes a microphone electric contact or a terminal. A microphone carrier(3) includes a carrier electrical terminal. An integrated circuit die includes a first surface which includes a die electrical terminal connected operatively connected to signal control circuit or signal amplification. A first conductive path is arranged on the first surface of the integrated circuit die. The first conductive path forms a closed loop which surrounds the die electrical terminal. A solder sealing ring surrounds and encapsulates die electric contacts(5) and carrier electric contacts.