发明名称 Packaging or mounting a component
摘要 <p>A method includes forming a slot in a sheet through a conductive layer thereof, the slot having width in a first direction between first and second edges and length in a second, transverse direction between first and second ends, providing a non-conductive layer on the sheet, the non-conductive layer having at least one window including a first window with length greater than the slot length and width less than the slot width, the first window positioned with respect to the slot such that edges of the first window are inside the edges of the slot and ends of the first window are outside the ends of the slot, placing a component on the conductive layer within the first window so as to bridge the slot and cutting through the sheet and the non-conductive layer along first and second lines outside sides of the component and within the edges the slot.</p>
申请公布号 GB0912742(D0) 申请公布日期 2009.08.26
申请号 GB20090012742 申请日期 2009.07.22
申请人 NOVALIA LTD 发明人
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