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发明名称
METHOD OF FORMING COPPER INTERCONNECT CAPPING LAYERS WITH IMPROVED INTERFACE AND ADHESION
摘要
申请公布号
EP1303876(B1)
申请公布日期
2009.08.26
申请号
EP20010941965
申请日期
2001.06.04
申请人
ADVANCED MICRO DEVICES, INC.
发明人
NGO, MINH, VAN;RUELKE, HARTMUT;MERGILI, LOTHAR;HOHAGE, JOERG;YOU, LU;HUERTAS, ROBERT, A.;HUANG, RICHARD
分类号
H01L21/3205;H01L21/768;H01L21/318;H01L23/52
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
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