| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processor capable of reducing the foot print and enhancing the throughput. SOLUTION: A pre-processing chamber 120 is disposed in a vacuous carrying chamber 102 of a processor. The pre-processing chamber 120 comprises a positioning mechanism 128 which rotates a wafer W mounted on a mounting stand 130, and positions the wafer W by an optical sensor 134; and a UV lamp 124 which radiates UV via a UV transmission window 126 meshing with a ceiling part of the pre-processing chamber 120 on a surface of the wafer W at the same time as positioning, and removes carbon adhered to the wafer W. The UV is radiated also on a processing gas to be supplied into the pre- processing chamber 120 to remove the carbon also by active atoms generated from the processing gas. As the pre-processing chamber 120 is formed in the vacuous carrying chamber 102, the foot print of the processor can be decreased. As the positioning of the wafer W and a contamination removal processing are simultaneously carried out, the throughput is enhanced.</p> |
