| 摘要 |
A bonding structure and a method for bonding substrates using the same are provided to block spread of a molten bonding material by forming a bump on a substrate. A bonding structure includes a first substrate(10), a bonding material(20), and a bump(30). The bonding material is positioned on the first substrate. The bonding material is a eutectic solder, a high lead solder, a lead free solder, gold, or a gold alloy. The bump is separated from the bonding material, and is formed on the substrate. The bump is formed with a straight line, a bent line, or a curved line. A height of the bump from the substrate is less than a height of the bonding material.
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