发明名称 WIRE-INSCRIBED PRINTED CIRCUIT BOARD
摘要 The invention relates to a wire-inscribed printed circuit board, comprising a conductive film, preferably a stabilization means connected to the conductive film, and at least one conductor wire which is electrically or thermally connected to at least one region which is provided to form a connection point. Said region comprises a core and a sheath preferably applied in a coating process, wherein the core contains a metal, and the sheath has at least one layer which contains a metal that differs from the metal of the core.
申请公布号 EP2092811(A1) 申请公布日期 2009.08.26
申请号 EP20070819660 申请日期 2007.11.07
申请人 JUMATECH GMBH 发明人 WOELFEL, MARKUS
分类号 H05K3/10;H05K7/06 主分类号 H05K3/10
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