SUBSTRATE FOR SEMICONDUCTOR PACKAGE

摘要

A substrate for a semiconductor package is provided to prevent the bending in the substrate by controlling the balance of the physical variation bent by the heat by forming a dummy pattern made of the metal. A circuit pattern(220) is formed on one side of an insulating layer(210). A dummy pattern(250) is formed in the other surface of the insulating layer to prevent the bending. A solder mask(230) is formed in one surface and the other surface of the insulating layer including a dummy pattern and a circuit pattern. The dummy pattern is made of the metal with the thermal expansion coefficient corresponding to the circuit pattern. The dummy pattern has the size corresponding to the circuit pattern. The dummy pattern has the thickness corresponding to the circuit pattern.