发明名称 SHOCK-ABSORBING STRUCTURE INCREASING CONTACT AREA FOR BUILDING BOTTOM
摘要 A buffer layer connection structure for a building floor increasing the contact area is provided to increase the workability of the tapping operation by controlling the deformation of the buffer layer. A buffer layer connection structure for a building floor increasing the contact area comprises a plurality of buffer layers(100) and a waterproof tape(200). The buffer layer has a finish mortar layer or the lightweight cellular concrete layer at the lower part to support the load and block the floor impact sound. A protrusion(110) is formed on the top and bottom side of one circumference. A depression part(120) is formed on the top and bottom side of the other circumference to go in gear with the protrusion. The waterproof tape is attached a connection part of the buffer layer. The waterproof tape blocks the water to move to the lower part from the top. The buffer layer comprises a supporting plate supporting the load and a buffer unit blocking the floor impact sound.
申请公布号 KR20090089222(A) 申请公布日期 2009.08.21
申请号 KR20080014653 申请日期 2008.02.18
申请人 PARK, YON JUN 发明人 PARK, YON JUN
分类号 E04F15/20;E04B1/98 主分类号 E04F15/20
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