CHEMICAL MECHANICAL POLISHING PAD

摘要

A chemical mechanical polishing pad is provided to reduce the scratch generated from a polished surface by having an inclined surface on a polishing surface. A chemical mechanical polishing pad comprises a polishing surface(20), a non-polishing surface(22), a side and a plurality of grooves. The non-polishing surface is formed at the opposite side to the polishing surface. The side connects the outer side of the polishing surface with the outer side of the non-polishing surface. The grooves are installed on the polishing surface. The side has an inclined surface connected with the polishing surface. The depth of a groove is the same as the height of the inclined surface or less.