| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an insulating film with a multilayer printed wiring board supporter and a multilayer printed wiring board that have achieved an epoxy resin composition having high fluidity, high reliability, and a low thermal expansion coefficient. <P>SOLUTION: In the insulating film with a multilayer printed wiring board supporter, a film in a half-cured state of an insulating resin composition containing (A) solid state multifunctional epoxy resin, (B) liquid state epoxy resin, (C) polyamide-imide containing phenol hydroxyl group the weight average molecular weight of which is 30,000 or less, and (D) inorganic filler is formed on the surface of the supporter. In the multilayer printed wiring board, on an inner layer circuit of a substrate having an inner layer circuit on one or both surfaces, an insulating resin layer and a circuit are laminated sequentially and the insulating resin layer is a cured insulating resin composition and the thermal expansion coefficient of which is 40 ppm/K or less. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
