| 摘要 |
<p>A method of fabricating a stack package is provided to make the size of the semiconductor package light by electrically connecting the top of semiconductor package to the lower part. The lead frame interposer(170) is parallelly formed with the side of the printed circuit board(100) of the semiconductor device frame. The second metal wire(130b) electrically connects the lead frame interposer and semiconductor device frame. The semiconductor chip(120) is arranged on the printed circuit board by the adhesive(110). The first metal wire(130a) electrically connects the semiconductor chip and printed circuit board. A plurality of first solder balls(160a) is adhered to the ball land(150).</p> |
