发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE POSITIVE PHOTOSENSITIVE COMPOSITION, AND COMPOUND USED FOR THE POSITIVE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which ensures a good pattern profile and good line edge roughness in normal exposure (dry exposure) and immersion exposure, a pattern forming method using the positive photosensitive composition, and to provide a compound used for the positive photosensitive composition. <P>SOLUTION: The positive photosensitive composition includes (A) a resin (A-1) which has a repeating unit having a group represented by formula (I) and of which the solubility in an alkali developer increases by the action of an acid and a resin (A-2) of which the solubility in an alkali developer increases by the action of an acid, and (B) a compound which generates an acid upon irradiation with actinic rays or radiation, wherein R<SB>1</SB>and R<SB>2</SB>represent a monovalent organic group, R<SB>1</SB>and R<SB>2</SB>may be the same or different and may bond to each other to form a cyclic structure; R<SB>3</SB>-R<SB>6</SB>represent a hydrogen atom or a monovalent organic group, R<SB>3</SB>-R<SB>6</SB>may be the same or different and may bond to each other to form a cyclic structure; L<SB>0</SB>represents a (p+1)-valent linking group; m and n represent an integer of 0-5, provided that m+n&ge;3; and p represents an integer of 1-3. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009186503(A) 申请公布日期 2009.08.20
申请号 JP20080023077 申请日期 2008.02.01
申请人 FUJIFILM CORP 发明人 YOSHIDA YUKO
分类号 G03F7/039;C08F20/26;H01L21/027 主分类号 G03F7/039
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