| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad grinding ring improving grinding efficiency during grinding of a surface layer portion of a polishing pad. <P>SOLUTION: The polishing pad grinding ring 160 is used for a wafer polishing device in order to grind the surface layer portion of the polishing pad. The grinding ring has: an annular ring body 161; a gear section 162 provided at an outer peripheral edge of the ring body 161 to mesh with a planetary gear mechanism; a grinding inner hole 163 formed inside the ring body 161; and grinding grooves 164 formed from the inner hole 163 to the gear section 162. The inner hole 163 has a circular opening with its center 03 located at a position different from the center 04 of an outer circumferential circle R of the ring body 161. <P>COPYRIGHT: (C)2009,JPO&INPIT |
