发明名称 |
SEMICONDUCTOR DEVICE, ELECTROOPTICAL DEVICE, ELECTRONIC APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING ELECTROOPTICAL DEVICE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide the configuration of a semiconductor device (array substrate) capable of attaining improvement in characteristics. SOLUTION: A semiconductor device includes a plurality of thin film transistors (T) formed on a base insulating film on a substrate. The plurality of thin film transistors include a plurality of semiconductor films (17) formed on the base insulating film (15) and a plurality of gate electrodes (G) formed on the plurality of semiconductor films via a gate insulating film (19), respectively, and the base insulating film is formed while being divided into areas each including at least one of the plurality of semiconductor films. The semiconductor device is thus configured so that, since the base insulating film is not formed all over the surface but divided into areas including the semiconductor films, the base insulating film can be reduced from being cracked, thereby improving characteristics of the thin film transistors formed in an upper portion thereof. Furthermore, device productivity can be improved. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009188317(A) |
申请公布日期 |
2009.08.20 |
申请号 |
JP20080028864 |
申请日期 |
2008.02.08 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MIYASAKA MITSUTOSHI;MIYAZAKI ATSUSHI |
分类号 |
H01L29/786;G09F9/00;G09F9/33 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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