| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form an air gap in a microstructure by degrading a sacrificial membrane material by diffusion of a chemical etchant through a membrane. <P>SOLUTION: A process for producing at least one air gap 35 in a microstructure comprises steps of: (a) supplying a microstructure comprising at least one gap 35 filled with a sacrificial material, wherein the gap 35 is limited by having at least a part of the surface thereof covered with a film 33 which is an impermeable membrane but can be rendered permeable by the action of a chemical etchant being capable of degrading the sacrificial material; (b) bringing the chemical etchant into contact with the microstructure in order to make the membrane 33 permeable and degrade the sacrificial material; and (c) removing the chemical etchant from the microstructure, wherein the chemical etchant is a fluid containing hydrofluoric acid and/or ammonium fluoride. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
