| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board in which an insulating base material is impervious to cracks even if stress resulting from a difference in linear expansion coefficient in a thickness direction between a chip component and the insulating base material is applied on the insulating base material. <P>SOLUTION: Fibrous molecules FM constituting resin films 1a and 1b are arranged so that longitudinal directions of the fibrous molecules FM are almost parallel to each other within the film planes of the resin films 1a and 1b. When it is assumed that a direction of the resin films 1a and 1b determined by averaging the longitudinal directions of the fibrous molecules FM is MD and that a direction of the resin films 1a and 1b perpendicular to MD is TD, the resin films 1a and 1b are anisotropic films having a difference in linear expansion coefficient or strength between MD and TD. The multiple resin films 1a and 1b are stacked so that MDs of adjacent resin films 1a and 1b cross each other. A multilayer circuit board includes a chip component 3 embedded in an insulating base material 1 composed of the multiple stacked resin films 1a and 1b. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
