发明名称 LASER DICING SHEET AND METHOD FOR MANUFACTURING CHIP BODY
摘要 PROBLEM TO BE SOLVED: To prevent the cutting of a dicing sheet, damage to a chuck table and the fusion bonding of a dicing sheet to a chuck table by laser light in laser dicing. SOLUTION: The laser dicing sheet is characterized in that it includes a base material formed of poly (oxy-alkylene) and an adhesive layer formed on one side thereof. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188303(A) 申请公布日期 2009.08.20
申请号 JP20080028730 申请日期 2008.02.08
申请人 LINTEC CORP 发明人 WAKAYAMA YOJI;SATO YOUSUKE
分类号 H01L21/301;C09J7/02 主分类号 H01L21/301
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