| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device that reduces the amount of side etching of wet etching processing while maintaining cleanness of a chemical, and a wet etching device. SOLUTION: Disclosed is the manufacturing method of the semiconductor device that has a chemical tank 30 for circulating the reserved chemical by a predetermined amount of circulation at processing standby time and includes a stage of dipping the semiconductor device 110 in the chemical tank to carry out wet etching processing, the manufacturing method of the semiconductor device being characterized in that before the semiconductor device 110 is dipped in the chemical tank 30, reduction control over the amount of chemical circulation is carried out to make the amount of chemical circulation less than the predetermined amount of circulation. COPYRIGHT: (C)2009,JPO&INPIT
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