CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICES

摘要

Light-emitting devices, and related components, systems, and methods associated therewith are provided. A light-emitting device can comprise a light-emitting die comprising a light-generating region capable of generating light and an emission surface through which generated light is capable of being emitted, and a package layer at least partially disposed over at least a portion of the light-emitting die emission surface, wherein the package layer has an aperture through which light from the light-emitting die is capable of being emitted. The light-emitting device can be a chip-scale packaged device where the device area can be less than 3 times the light-emitting die emission surface area and/or the device thickness can be less than 2 times the light-emitting die thickness.