| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate including a built-in capacitor for suppressing the missing of a conductor and enabling the easier shielding of high frequency noise, and also provide a method for manufacturing the same substrate. <P>SOLUTION: The substrate including the built-in capacitor is provided with a conductive layer 12, a substrate 13, a capacitor 14, and a conductor 18. A size of the shorter side in an aperture shape of a through-hole 13b at the upper surface 13a is 150μm or smaller, a ratio of the depth of the through-hole 13b to the size of the shorter side is 2/3 or larger, and an area of the conductor 18 in the direction orthogonally crossing the direction providing the minimum distance up to the conductive layer 12 from the capacitor 14 is 0.09 mm<SP>2</SP>or larger. The conductive layer 12 includes ground potential. The substrate 13 is formed on the conductive layer 12 with the inclusion of the through-hole 13b reaching the conductive layer 12 from the upper surface 13a. The capacitor 14 is formed on the upper surface 13a. The conductor 18 fills the internal side of the through-hole 13b to electrically connect the conductive layer 12 and the capacitor 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
