发明名称 RESIN COMPOSITION
摘要 <p>Disclosed is a resin composition comprising: a resin (a1) which contains a siloxane bond and has a number average molecular weight of 500 to 300,000 (inclusive); and a resin (a2) which contains no siloxane bond and has a number average molecular weight of 1000 to 300,000 (inclusive).</p>
申请公布号 WO2009102035(A1) 申请公布日期 2009.08.20
申请号 WO2009JP52436 申请日期 2009.02.13
申请人 ASAHI KASEI E-MATERIALS CORPORATION;SHIMURA, TADASHI 发明人 SHIMURA, TADASHI
分类号 C08F299/06;B41C1/05;B41N1/12 主分类号 C08F299/06
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