发明名称 |
A LED AND ITS MANUFACTURING METHOD |
摘要 |
<p>A LED and its manufacturing method are provided. Said LED includes: heat-sink substrate; a metal contact pad which is formed on the heat-sink substrate; a reflecting layer which is formed on the metal contact pad, and a lighting lamilation which is formed on the reflecting layer. The lighting lamination includes a p-type layer, an lighting layer and a n-type layer which are formed successively; two electrode layer which are formed on the back side of the heat-sink substrate and the n-type layer respectively.</p> |
申请公布号 |
WO2009100603(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
WO2008CN01037 |
申请日期 |
2008.05.28 |
申请人 |
HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.;FAN, BEN;WENG, JOE |
发明人 |
FAN, BEN;WENG, JOE |
分类号 |
H01L21/00;H01L21/60;H01L33/40;H01L33/64 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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