| 摘要 |
<p>This invention provides a copper alloy plate material for electric and electronic components comprising 1.5 to 4.0% by mass of Ni and 0.3 to 1.5% by mass of Si with the balance consisting of Cu and unavoidable impurities. In terms of the surface roughness in a direction normal to the rolling direction of the plate, the average surface roughness, Ra, is not more than 0.3 mum, and the maximum height, Ry, is not more than 3.0 mum. In the frequency distribution curve that shows the concave and convex components of the surface roughness, the peak position is on the positive side (convex component) relative to the average of the curve showing the surface roughness. ® KIPO & WIPO 2009</p> |
