发明名称 POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem wherein a difference of accuracy in surface roughness and parallelism/flatness in a workpiece is caused by a difference in circumferential speeds of an inner circumferential part and an outer circumferential part of a carrier, since hardness of an artificial leather pad of a polishing pad which is conventionally used is uniform in a surface and the carrier in a planetary gear type polishing device makes circular movements including rotation and revolution. <P>SOLUTION: The polishing pad is structured as combination of doughnut-like forms and hardness of the combined artificial leather pads are changed so that the difference of surface roughness in polishing surfaces of the outer circumferential part and the inner circumferential part of the workpiece, is reduced and uniformity of accuracy of parallelism/flatness and the like is enhanced and thus production efficiency is improved. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009184084(A) 申请公布日期 2009.08.20
申请号 JP20080028330 申请日期 2008.02.08
申请人 CHIYODA KK;HAMAI CO LTD 发明人 TANAKA SATOSHI;NAKAMURA SHINJI;TOYODA KAZUHIKO
分类号 B24B37/24 主分类号 B24B37/24
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