| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip type electronic component storing mount which exhibits a strong peeling strength and suppresses fluffing from the mount when a cover tape is peeled away from the chip type electronic component storing mount. <P>SOLUTION: In the chip type electronic component storing mount formed of a multi-layered paper-processed board, the surface layer is the chip type electronic component storing mount containing an alkenyl ketene dimer. The alkenyl ketene dimer is preferably mixed with a water-soluble polymer to be applied. In addition, the water-soluble polymer is preferably at least one kind selected from polyvinyl alcohol, starch, and polyacrylamide. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
