| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a support plate which is easily peeled from a semiconductor wafer by using solvent but which is hard to be peeled from a substrate in a process for working the semiconductor wafer. <P>SOLUTION: The support plate 1 is stuck to the substrate 2 and supports the substrate 2. In the support plate 1, a plurality of openings 15 and 15' penetrate a bonding face facing the substrate 2 and a non-bonding face confronted with the bonding face. A region 13 where an opening formed of a first region 11 and a second region 12 surrounding the first region 11 is formed is arranged on the bonding face. A rate of the opening in the first region 11 is larger than that of the second region 12. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
