| 发明名称 |
Intermediate Bond Pad for Stacked Semiconductor Chip Package |
| 摘要 |
The invention provides apparatus and methods by which, in a stacked semiconductor chip package, a continuous electrical path may be provided among bond pads by way of one or more intermediate bond pad electrically isolated from its underlying surface.
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| 申请公布号 |
US2009206460(A1) |
申请公布日期 |
2009.08.20 |
| 申请号 |
US20070928996 |
申请日期 |
2007.10.30 |
| 申请人 |
REYES ELAINE BAUTISTA;ESTEPA ERWIN REMOBLAS;HORTALEZA EDGARDO RULLODA |
发明人 |
REYES ELAINE BAUTISTA;ESTEPA ERWIN REMOBLAS;HORTALEZA EDGARDO RULLODA |
| 分类号 |
H01L23/49;H01L21/60 |
主分类号 |
H01L23/49 |
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