发明名称 |
FLIP CHIP DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.
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申请公布号 |
US2009206478(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
US20090429237 |
申请日期 |
2009.04.24 |
申请人 |
TAIWAN TFT LCD ASSOCIATION;CHUNGHWA PICTURE TUBES,LTD.;AU OPTRONICS CORP.;HANNSTAR DISPLAY CORP.;CHI MEI OPTOELECTRNICS CORP.;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;TOPPTOLY OPTOELECTRONICS CORP.;QUANTA DISPLAY INC. |
发明人 |
CHEN WEN-CHIH;YANG SHENG-SHU |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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地址 |
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