发明名称 Method and apparatus for polishing object
摘要 A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying out a first polishing step by pressing a polishing pad of a polishing device, having a diameter which is smaller than the radius of the object, against the surface of the object at a first pressure while moving the polishing pad and the object relative to each other at a first relative speed. The first polishing step is terminated at a point in time when a surface level difference in the object is eliminated to a targeted level. The method further comprises carrying out a second polishing step by pressing a polishing pad of a polishing device, having a diameter which is larger than the diameter of the object, against the surface of the object at a second pressure while moving the polishing pad and the object relative to each other at a second relative speed.
申请公布号 US2009209176(A1) 申请公布日期 2009.08.20
申请号 US20090320976 申请日期 2009.02.10
申请人 EBARA CORPORATION 发明人 KATSUOKA SEIJI;TSUJIMURA MANABU
分类号 B24B37/005;B24B37/013;B24B37/10;B24B49/10;B24B49/16;H01L21/304 主分类号 B24B37/005
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