| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the yield of a semiconductor package, and to reduce cost. <P>SOLUTION: A substrate (for example, 110) having a wiring pattern including a fine pattern whose wiring pitch is narrow on the surface and a substrate (for example, 120a and 120b) having a wiring pattern including not any fine pattern but only a rough pattern whose wiring pitch is wide are separately prepared so as to be connected to a device with a large number of pins, and devices are loaded on the respective substrate, and those substrates are laminated so that a semiconductor package (for example, 200) can be obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT |
