| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that the adhering area of a circuit board is increased with increasing the size of a panel screen, the quantity of an adhesive used each time is increased, the frequency of exchanging a reel with adhesive tape wound is increased and the production efficiency of electronic equipment is not increased due to time-consuming exchange of the reel. SOLUTION: In an adhesive tape crimping method of applying the adhesive 11 to the entire of one surface of a base material 9 and crimping the adhesive to the circuit board 21 using the reeled-up adhesive tape 1, the width of the adhesive tape is more than the length of one side of the circuit board and part of the adhesive oriented in a cross direction of the adhesive tape is crossly heated and pressed to crimp the adhesive to the circuit board while decreasing the cohesion of the heated part of the adhesive. COPYRIGHT: (C)2009,JPO&INPIT
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