摘要 |
PROBLEM TO BE SOLVED: To solve a problem that when the distance between connection terminals of a semiconductor element is made long merely to make an insulation distance long, electronic equipment is upsized as a case containing the semiconductor element becomes larger, or the case containing the semiconductor element becomes complicated in a structure having a step formed on an outer peripheral surface of the case, thus resulting in a rise of cost. SOLUTION: An insulating member 8 comprising a stripe and a folded portion connected with the stripe and formed in a rectangular shape by folding the stripe is mounted between a conductive plate 6 connecting connection terminals 2 of a plurality of semiconductor elements 3 and 4 and conductive plates 5 and 7 connecting other connection terminals 1 of the plurality of semiconductor element to easily maintain insulation even in the deposition of a conductive substance. COPYRIGHT: (C)2009,JPO&INPIT
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