| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a system and method for monitoring a manufacturing process. <P>SOLUTION: The system and method for monitoring a manufacturing process is disclosed. A wafer is provided. Process parameters of a manufacturing machine are in-situ measured and recorded when the wafer is processed in the manufacturing machine. The wafer measured value of the wafer is measured after the wafer has been processed. The process parameters are transformed into a process sum value. A two-dimensional orthogonal chart with a first axis representing the wafer measured value and a second axis representing the process sum value is provided. The two-dimensional orthogonal chart includes a closed-loop control limit. A visualized point representing the wafer measured value and the process sum value is displayed on the two dimensional orthogonal chart. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
