ADHESIVE FOR ELECTRONIC PART AND MANUFACTURING METHOD OF ADHESIVE FOR ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for electronic parts that has a low linear expansion coefficient and exhibits excellent dimensional stability against repetition of a thermal shock cycle even when the thickness thereof is further diminished for further size reduction and higher integration of a semiconductor package. SOLUTION: The adhesive for electronic parts comprises an epoxy compound, a curing agent and an inorganic filler, where the inorganic filler has an average particle size of at most 100 nm and the largest particle size of less than 200 nm and the content of the inorganic filler is at least 30 wt.%. COPYRIGHT: (C)2009,JPO&INPIT