| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein a lead frame section comes off when using a thick material, such as the lead frame, in a conventional thermal dissipation substrate. SOLUTION: A folded section 21, or the like that is one portion of the lead frame fixed to a heat transfer layer 13 is strongly fixed by a hole 16 and a screw 18 provided in a resin structure 15, and the lead frame 14 allows external wiring 23 to be electrically connected to the folded section 21 that is one portion of the lead frame 14 via the strongly fixed resin structure 15, thus providing the thermal dissipation substrate 11 not easily affected by external force propagated from the outside via the external wiring 23, or the like. COPYRIGHT: (C)2009,JPO&INPIT
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