| 摘要 |
PROBLEM TO BE SOLVED: To provide a device with a hollow structure and its manufacturing method, surely closing an opening without deep intrusion of liquid resin into a gap of the hollow structure. SOLUTION: The device with the hollow structure is equipped with a substrate 201 having a main surface, a metal film 204, a resin film 208, and a liquid repelling film 207a. The metal film 204 is provided on the substrate 201 so that the gap having the opening is formed between a part of the main surface and it. The resin film 208 comprises cured resin, and closes openings 206a and 206b. The liquid repelling film 207a is provided on an inner surface of the gap, and has properties for enlarging a contact angle of the resin in the liquid state to be larger than the substrate 201 and the metal film 204. COPYRIGHT: (C)2009,JPO&INPIT
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