摘要 |
<p>A electronic circuit package (1) having a flexible substrate (2) with metals layers on one or more of its surface forming a wiring pattern (9) and/or surface mount bonding pads (11, 12). Passive electronic components (6, 7, 8) are integrated onto component package (4) that is mounted on the flexible substrate (2) and electrically connected with the wiring pattern (9) bonding pads (11, 12). An active electronic device (5, 13) is mounted on the flexible substrate (2) or bonding pads (11, 12). The flexible substrate (2), the passive electronic components (6, 7, 8) and the active electronic device (5, 13) are encapsulated by encapsulating material (15).</p> |
申请人 |
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCHINSTITUTE CO. LTD.;LEUNG, LAP-WAI, LYDIA;CHUNG, CHANG HWA;LIU, JIE;LEUNG, CHI KUEN;CHAN, CHIU LUN |
发明人 |
LEUNG, LAP-WAI, LYDIA;CHUNG, CHANG HWA;LIU, JIE;LEUNG, CHI KUEN;CHAN, CHIU LUN |